Lamination is the arrangement of the copper layers and insulators that make up the circuit board before the final layout of the PCB design. Planning a good setup is not an easy task, and companies that manufacture multilayer PCB must be the leaders of the professionals. Multilayer panels improve PCB's energy distribution capabilities, reduce mutual interference, eliminate electromagnetic interference and support high-speed signals. While the layout allows you to accommodate multiple electronic circuits on a single board using different layers on the PCB, the architecture of the PCB layout design has many other advantages:

• The stacking of PCB layers can help minimize the susceptibility to external interference, minimize radiation, and reduce the impedance and spurious problems of high-speed signals.
• Good PCB design can also promote efficient and cost-effective final production;
• Properly constructed PCB layers can improve the EMC of the project.

    In the case of single or double circuit boards, little consideration is given to the thickness of the board. With the advent of multilayer PCB, the quantity of materials used became more and more critical, and the final cost was the factor affecting the whole project. The simplest structures can include four layers of PCB, while more complex boards have specialized sequential laminating. The higher the number of PCB, the freer the designer can untangle the circuit, and the less likely it is to encounter an "impossible" solution. The PCB overlap operation consists of laying out the copper layer and the insulation layer of the circuit.The Settings you choose will certainly play an important role in panel performance in a number of ways.

   For example, good layering of PCB can be reduced the impedance of the PCB and limit radiation and stray signals. It also has a significant impact on the EMC performance of the product. On the other hand, poor design can be significantly increased circuit radiation and noise.There are four important factors to consider when installing a panel:

• Layer
• Number and type of plans to be used (power supply and ground);
• Ranking and order of grades;
• Distance between levels.