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Technology capability
P C B
Item Standard Advanced
Layer count 40L 48L
Board thickness 5.5mm 6.5mm
Aspect ratio 10:1 14:1
Copper thickness 6OZ 12OZ
Maxium PCB size 1L: 500×2000mm 540×2000mm
2L : 500×1200mm 540×1200mm
≥4L: 540*650mm 540*650mm
Min. 4L board thickness 0.38mm 0.35mm
Min. hole & pad size 0.20/0.40mm 0.15/0.35mm
Drilling Acuracy ±0.05mm ±0.038mm
Min. solder mask bridge 0.065mm 0.065mm
PTH hole size tolerance ±0.05mm ±0.038mm
Contour tolerance ±0.05mm ±0.05mm
Impedance tolerance ±8% ±6%(Differential impedance)
Min. line width/spacing 0.075/0.075mm 0.065/0.065mm
Surface finish ENIG, OSP,Lead free HASL, Gold plating(hard gold),Immersion Silver, Immersion Tin, Tin plating, Silver plating, Carbon ink
H D I
Item Standard Advanced
HDI stage 3+N+3 Anylayer
Aspect ratio for blind via 1:1 1:1
Min. 8L board thickness 0.70mm 0.65mm
Min. line width/spacing 0.05/0.05mm 0.05/0.05mm
Key line/tolerance 0.065mm/15% 0.06mm/10%
Min. blind via diameter 0.10mm 0.09mm
Min. capture pad size 0.23mm 0.20mm
Min. PTH diameter 0.20mm 0.175mm
Min. PTH PAD size 0.35mm 0.30mm
Min. clearance(copper to SM opening) 0.038mm 0.025mm
Min. solder mask bridge 0.065mm 0.065mm
Min. CSP/BGA pitch 0.40mm 0.35mm
PTH hole size tolerance ±0.05mm ±0.038mm
Contour tolerance ±0.05mm ±0.05mm
Impedance tolerance ±8% ±6%(for differential impedance)
Surface finish ENIG, OSP,Lead free HASL, Gold plating(hard gold),Immersion Silver, Immersion Tin, Tin plating, Silver plating, Carbon ink
F P C
Item Standard Advanced
Layer count 8L 10L
Maxium PCB size 2000*240mm 2000*240mm
Min. line width/spacing 1/4OZ 0.04mm 0.04mm
1/3OZ 0.05mm 0.05mm
1/2OZ 0.055mm 0.055mm
Min. PTH size 0.15mm 0.1mm
Min. PTH PAD size 0.25mm 0.2mm
Min. blind via diameter 0.10mm 0.075mm
Min. capture pad size 0.25mm 0.175mm
Min. solder mask bridge 0.065mm 0.065mm
Coverlay registration tolerance 0.15mm 0.10mm
PTH hole size tolerance ±0.05mm ±0.038mm
Contour tolerance ±0.05mm ±0.05mm
Impedance tolerance ±8% ±6%(for differential impedance)
Min. slot hole width 0.60mm 0.50mm
Pitch tolerance ±0.05mm ±0.03mm
Air Gap capability YES Yes
Surface finish ENIG, OSP, Gold plating(hard gold)