Technical Parameters
Layer count: 1 stage 10 layer
Board thickness:1.6mm
Dimension:161*94.88mm
Raw material:FR4 IT180A
Copper thickness on the board surface:≥35um
Copper thickness in the hole barrel:20um
Min.line width/space:0.05mm
Minimum hole diameter:0.1mm
Surface finishing:immersion gold≥1u"
Application:GPS
Advanced LDI machine can meet your strict spec of line width/space 0.05mm
and hole positioning accuracy of ±0.05mm.
Leading edge technology:
min. BGA pad: 0.2mm; matt black solder mask; min solder mask dam: 0.1mm.
IPC class III standard compliant.
SLPS ERP system enables us to provide quick-turn delivery for time-critical applications:
5-day lead time for sample and 7-day lead time for volume production.
* Contact name: | |
Company name: | |
* Phone number: | |
Email: | |
* Your message: | |
Verification code: | |