S& L

Engaging in PCB R&D and manufacturing for 18 years Leading the innovation of PCB technology

Technical Parameters

Part Number:S10C31828
Layer count: 1 stage 10 layer 
Board thickness:1.6mm
Raw material:FR4 IT180A
Copper thickness on the board surface:≥35um
Copper thickness in the hole barrel:20um
Min.line width/space:0.05mm
Minimum hole diameter:0.1mm 
Surface finishing:immersion gold≥1u"
Technology Feature


Advanced LDI machine can meet your strict spec of line width/space 0.05mm

and hole positioning accuracy of ±0.05mm.



                 Leading edge technology:

                 min. BGA pad: 0.2mm; matt black solder mask; min solder mask dam: 0.1mm.




Imported Tektronix DSA8200 impedance tester.





 IPC class III standard compliant.





     SLPS ERP system enables us to provide quick-turn delivery for time-critical applications:

     5-day lead time for sample and 7-day lead time for volume production.


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