S& L

Engaging in PCB R&D and manufacturing for 18 years Leading the innovation of PCB technology

Technical Parameters

Part Number:GHS04K03404
Layer count: 1 stage 4 layer 
Board thickness:0.6mm
Raw material:FR4 EM825
Copper thickness on the board surface:≥35um
Copper thickness in the hole barrel:20um
Min.line width/space:0.075mm
Minimum hole diameter:0.1mm 
Surface finishing:immersion gold≥2u"+OSP
Application:telecom module

Technology Feature




  Special numerical controlled routing
      machine can meet your specific 
         requirement of half hole.








   Min. line width/space: 0.075/0.075mm, Min. BGA pad: 0.2mm





 We process copper filling for blind via with advanced DVCP lines to prevent bubbling inside the filled blind via.









We guarantee excellent quality to improve
the production yield at customer end.





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