Technical Parameters
Part Number：GHS04K03404
Layer count: 1 stage 4 layer
Board thickness：0.6mm
Dimension：128*100.89mm
Raw material：FR4 EM825
Copper thickness on the board surface：≥35um
Copper thickness in the hole barrel：20um
Min.line width/space：0.075mm
Minimum hole diameter：0.1mm
Surface finishing：immersion gold≥2u"+OSP
Application：telecom module
Technology Feature
Special numerical controlled routing
machine can meet your specific
requirement of half hole.
machine can meet your specific
requirement of half hole.
Min. line width/space: 0.075/0.075mm, Min. BGA pad: 0.2mm
We process copper filling for blind via with advanced DVCP lines to prevent bubbling inside the filled blind via.
We guarantee excellent quality to improve
the production yield at customer end.
the production yield at customer end.
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