Technical Parameters
Part Number:GHS04K03404
Layer count: 1 stage 4 layer
Board thickness:0.6mm
Dimension:128*100.89mm
Raw material:FR4 EM825
Copper thickness on the board surface:≥35um
Copper thickness in the hole barrel:20um
Min.line width/space:0.075mm
Minimum hole diameter:0.1mm
Surface finishing:immersion gold≥2u"+OSP
Application:telecom module
machine can meet your specific
requirement of half hole.
We process copper filling for blind via with advanced DVCP lines to prevent bubbling inside the filled blind via.
the production yield at customer end.
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