S& L

Engaging in PCB R&D and manufacturing for 18 years Leading the innovation of PCB technology

Technical Parameters

Part Number:GHM08C02008A0 
Layer count: 3 stage 10 layer
Board thickness:1.6mm
Raw material:FR4 EM825
Copper thickness on the board surface:≥35um
Copper thickness in the hole barrel:20um
Min.line width/space:0.10mm
Minimum hole diameter:0.10mm 
Surface finishing:immersion gold≥1u"
Application:monther board of POS device 

Technology Feature


Special numerical controlled routing machine can meet your strict dimensional spec of ±0.1mm,
Hole positioning tolerance:±0.05mm.





We guarantee accuracy of line width/space with Hitachi automatic CCD exposure machine         
 to provide excellent signal transmission performance.      

We process buried hole of inner layer with our 
special resin-plugging technology for better stability.













We guarantee excellent quality and improve production yield 
     and reliability performance at customer end.





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