Technical Parameters
Part Number：GHM08C02008A0
Layer count: 3 stage 10 layer
Board thickness：1.6mm
Dimension：141*110.88mm
Raw material：FR4 EM825
Copper thickness on the board surface：≥35um
Copper thickness in the hole barrel：20um
Min.line width/space：0.10mm
Minimum hole diameter：0.10mm
Surface finishing：immersion gold≥1u"
Application：monther board of POS device
Technology Feature
Special numerical controlled routing machine can meet your strict dimensional spec of ±0.1mm,
Hole positioning tolerance:±0.05mm.
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We guarantee accuracy of line width/space with Hitachi automatic CCD exposure machine
to provide excellent signal transmission performance.
to provide excellent signal transmission performance.
We process buried hole of inner layer with our
special resin-plugging technology for better stability.
special resin-plugging technology for better stability.
We guarantee excellent quality and improve production yield
and reliability performance at customer end.
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