Technical Parameters
Part Number：GHM10C01309
Layer count: 2 stage 10 layer
Board thickness：1.6mm
Dimension：168*128.89mm
Raw material：FR4 EM825
Copper thickness on the board surface：≥35um
Copper thickness in the hole barrel：20um
Min.line width/space：0.075mm
Minimum hole diameter：0.1mm
Surface finishing：immersion gold≥1u"
Application：industrial
Technology Feature
Special numerical controlled routing machine can meet your
strict dimensional spec of ±0.1mm, Min. BGA pad:0.2mm;
strict dimensional spec of ±0.1mm, Min. BGA pad:0.2mm;
We use selected material for excellent quality performance.
Automatic production
lines mitigate risk
of manual operation.
IPC class III standard compliant.
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