Technical Parameters
Part Number：GHM10C01015
Layer count: 1 stage 10 layer
Board thickness：1.2mm
Dimension：121*100.88mm
Raw material：FR4 EM825
Copper thickness on the board surface：≥35um
Copper thickness in the hole barrel：20um
Min.line width/space：0.1mm
Minimum hole diameter：0.1mm
Surface finishing：immersion gold≥1u"
Application：public security surveillance facility
Technology Feature
Special numerical controlled routing machine
can meet your strict dimensional spec of ±0.1mm,
Min. BGA pad:0.2mm;
can meet your strict dimensional spec of ±0.1mm,
Min. BGA pad:0.2mm;
Automatic production
lines mitigate risk
of manual operation.
lines mitigate risk
of manual operation.
100% high voltage
test for excellent reliability.
test for excellent reliability.
IPC class III standard compliant.
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