PCB factory china advises PCB multilayer board pressing technology
PCB lamination is a very important process for the production of circuit boards for PCB factory china. Many small and medium-sized enterprises can only make simple single-layer and double-layer boards. Once it involves multi-layer complex boards, they can't do it. This is not only because of the technical problems of the production personnel, but also mainly because of the machinery and equipment.
How is the multilayer board pressed when making the pcb board for PCB factory china?
1. Pressure cooker
This is a container that is filled with high-temperature saturated water vapor and can be applied with high air pressure. When PCB factory china making a pcb board, the laminated substrate sample can be placed in it for a period of time to force the water vapor into the board and then take it out The sample is then placed on the surface of high-temperature molten tin, and its "delamination resistance" characteristics are measured.
2. Cap pressing law
It refers to the traditional lamination method of early PCB multilayer board production. At that time, the "outer layer" mostly used single-sided copper thin substrates for stacking and pressing. It was not until the increase in output that the current copper skin type was used. The large or large amount of pressure is legal.
3. Folds
In multi-layer board pressing, it often refers to the wrinkles that occur when the copper skin is improperly handled.
4. Depression
Refers to the gentle and uniform sag on the copper surface during the production of the pcb board, which may be caused by the partial protrusion of the steel plate used for pressing. If these shortcomings are unfortunately left on the line after the copper is etched, it will cause high-speed transmission signals. The impedance is unstable, and the pcb board will appear noise.
5. Copper foil pressing method
Refers to the mass-produced PCB multilayer board, the outer layer of copper foil and film are directly pressed with the inner layer, which becomes the large-scale pressing method of multiple rows of multilayer boards to replace the traditional pressing method of single-sided thin substrates in the early days.
Other news about S&L
- PCB supplier china:Reasons and Advantages of Choosing Flex-Rigid PCB
- What is the differnece between the Rigid Flex PCB and A Flexible Circuit
- High Volume Health care PCB Assembly Benefits
- Tells you What is a High Frequency PCB
- FPC supplier:What Is The Difference Between Flexible PCB Coverlay And Solder Mask Layer
- Flexible PCB manufacturer:What is Flexible PCB Used For?
- PCB factory china:How are Layers Connected in Multilayer PCB
- PCB supplier china:How are Aluminum PCBs made?
- PCB manufacturer China:What is Via Hole in PCB
- What Are the Types of Rigid Flexible PCB?
Your browsing history
- FPC supplier:5G has become the main driving factor for the construction of base stations
- Advantages and Disadvantages of flex rigid PCB
- See us at IPC APEX 2017
- High-Frequency PCB Advanced Circuits Specification
- The method that circuit board factory saves manufacture cost
- Flexible PCB FPCB Applications
- S&L to showcase her cutting edge PCB technology at Electronica China 2017
- LDI stencil making system
- Amphenol
- Flexible pcb manufacturer S&L @ElectronicaChina 2018
A total of -comments【I want to comment】