With the commercialization of 5G, technologies and services such as artificial intelligence (AI), autonomous driving, Internet of Things, and Industry 4.0 are also benefiting. AR(Virtual Reality/Augmented Reality), Internet of Vehicles, Intelligent Manufacturing, Intelligent Energy, Wireless Medical, Wireless Home Entertainment, Internet-connected UAV, Social Network, Personal AI Assistant, Smart City, etc., will become the top 10 application scenarios with the most potential of 5G. By 2025, 100 billion 5G devices are expected to be connected.High-frequency and high-speed related materials and transmission fields will be more attention.

  Traditional coaxial cable transmission, in the light and thin demand of electronic products, there is a trend of using circuit board transmission line to replace, the measured thickness can be reduced by more than 66%, when the coaxial cable transmission line is replaced by flexible circuit board, the volume can be saved by 65%. The use of circuit board transmission lines can reduce the overall thickness of the phone that other high-end mobile terminals cannot reach。

  At present, this kind of ultra-thin high-frequency transmission signal line is surrounded by an insulating substrate, so the dielectric properties of the insulating layer determines the transmission loss, especially in the use of high frequency band, which also brings new opportunities to the FPC factory.

  At present, there are three categories of high frequency soft plate materials:

1.Liquid crystal polymer (LCP) soft plate substrate has good electrical properties, but the manufacturing process is difficult and the price is expensive.At present, the global soft substrate capacity is only about 500,000 square meters per month;In addition, LCP soft plate peeling force is not good.

2. The high frequency modified PI(Modi6EDPI) soft board substrate has a high water absorption rate, which is unfavorable to the application of high frequency, and the addition of fillers or polytetrafluoroethylene (PTFE) leads to the increase of the difficulty of the process, and affects the bending characteristics of the soft board.

3. Polyether ether ketone (PEEK) soft plate substrate supply is very small at present, the use of 275 ~ 350℃ high temperature and copper foil pressing (thermoplastic material), make the substrate product warping.