Reasons for connecting tin in wave soldering for Rigid flex PCB
Reasons for connecting tin in wave soldering for Rigid flex PCB:
1. Insufficient flux activity.
2. The wettability of the flux is insufficient.
3. The amount of flux applied is too small.
4. Uneven flux coating.
5. The circuit board cannot be coated with flux regionally.
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6. The circuit board is not tinned regionally.
7. Some pads or solder feet are seriously oxidized.
8. The wiring of the circuit board is unreasonable (the distribution of the components is unreasonable).
9. The direction of the board is not correct.
10. The tin content is not enough, or the copper exceeds the standard; [The melting point (liquidus) of the tin liquid is increased due to the excessive impurities.
11. The foaming tube is blocked and the foaming is uneven, resulting in uneven coating of the flux on the circuit board.
12. The setting of the air knife is unreasonable (the flux is not evenly blown).
13. The board speed and preheating are not well matched.
14. Improper operation method when dipping tin by hand.
15. The chain inclination is unreasonable.
16. Uneven crests.
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