Oct.25, a milestone of PCB manufacturer China S&L Circuits holds her grand cornerstone laying ceremony of Phase II operation in Ganzhou factory. The ceremony is hosted by the Director of administration department and all the senior management attended.  

The investment of phase II operation in Ganzhou facility is up to 130 million US dollars. With 581,000Sqft of building area, the phase II operation of PCB manufacturer China S&L Circuits is designed for the standard of Industry 4.0 and equipped with fully automatic production lines, aiming to be the most advanced PCB manufacturing facility in China. The new operation is planned start its production in Oct.2018 and the projected monthly capacity is up to 2.7million Sqft including HDI production and 0.54million Sqft for FPC and rigid-flex PCB.

Established in 2002, rigid PCB manufacturing is S&L’s primary business. Time flies and the market demand changes rapidly, S&L started to engage in diversified market sectors like smart phone, tablet and panel television, the development of technology leads the trend to portable and tiny applications and this requires new type of PCB like HDI, FPC (flexible PCB) and rigid-flex PCB. To cope with this market change, S&L launched her phase I operation in Ganzhou facility in 2013. However, the recent increased demand to HDI, FPC and rigid PCB requires PCB manufacturer China S&L Circuits to expend her production capacity. This is why, today, S&L Circuits holds her grand cornerstone laying ceremony of Phase II operation to satisfy her customers by reserving more capacity for their increasing demand.

One year later, we will witness S&L’s brand new start of her phase II operation to realize the company goal – to be the most valuable PCB manufacturer China.