FPCA welding involves many FPCA processing links, and the quality of FPCA welding is closely related to these links. FPCA electronics manufacturers must ensure that every link is done well in order to provide customers with high-quality FPCA services. Today, Sun&Lynn Flex rigid PCB factory’s FPCA will analyze with you what preparations the factory has to do before wave soldering?

1. Use a density meter to measure the density of the flux. If the density is too high, dilute it with a thinner.

2. Check the Flex rigid PCB to be soldered (the PCB has been coated with SMD glue, SMC/SMD SMD glue and solidified and completed the THC insertion process). The soldering surface of the socket and the gold finger and other parts of the attached component socket are coated with solder resist. Or stick it with high temperature resistant tape to prevent the socket from being blocked by solder after wave soldering. If there are large-size slots and holes, they should also be attached with high-temperature tape to prevent the solder from flowing to the upper surface of the Flex rigid PCB during wave soldering. (The water-soluble flux should be a liquid solder resist. After coating, place it for 30 minutes or bake under a light for 15 minutes before inserting the components. After soldering, it can be washed directly with water.)

3. If using traditional foaming flux, pour the flux into the flux tank.

These three steps are actually the work that must be done before the entire wave soldering process, and as an smt chip processing plant, the process file should be written first in the process control.