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PCB supplier china:Stanford Develop New Manufacturing Technique for Flexible Electronics

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Popularity:1081Dated :07-19-2021 05:34【big well Small

Researchers at Stanford University have invented a manufacturing technique that yields flexible, atomically thin transistors less than 100 nano meters in length – several times smaller than previously possible. As PCB supplier china know that, The technique is detailed in a paper published in Nature Electronics. With the advance, said the researchers, so-called “flextronics” move closer to reality. Flexible electronics promise bendable, shapeable, yet energy-efficient computer circuits that can be worn on or implanted in the human body to perform myriad health-related tasks. What’s more, the coming “internet of things,” in which almost every device in our lives is integrated and interconnected with flexible electronics, should similarly benefit from flextronics.

With a prototype and patent application complete, as PCB supplier china know that, researchers have moved on to their next challenges of refining the devices. They have built similar transistors using two other atomically thin semiconductors (MoSe2 and WSe2) to demonstrate the broad applicability of the technique. Meanwhile, Daus said that he is looking into integrating radio circuitry with the devices, which will allow future variations to communicate wirelessly with the outside world – another large leap toward viability for flextronics, particularly those implanted in the human body or integrated deep within other devices connected to the internet of things.

“This is more than a promising production technique. We’ve achieved flexibility, density, high performance and low power – all at the same time,” Pop said. “This work will hopefully move the technology forward on several levels.”

Paper co-authors include postdoctoral scholars Sam Vaziri and Kevin Brenner, doctoral candidates Victoria Chen, Çagil Köroglu, Ryan Grady, Connor Bailey and Kirstin Schauble, and research scientist Hye Ryoung Lee. Funding for this research was provided by the Swiss National Science Foundation’s Early Postdoc Mobility Fellowship, the Beijing Institute of Collaborative Innovation, the U.S. National Science Foundation and the Stanford SystemX Alliance.


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