Technical Parameters
Part Number：M40C23268
Layer count: 40
Board thickness：3.0mm
Dimension：158*83.21mm
Raw material：FR4 TG170 tuc
Copper thickness on the board surface：140um
Copper thickness in the hole barrel：50um
Min.line width/space：0.30mm
Minimum hole diameter：0.4mm
Surface finishing：immersion gold≥1u"
Application：telecom power supply
Technology Feature
Unique SLPS ERP system enables us
to monitor the entire production process in the palm.
Our specialized Burkle pressing machine provides excellent accuracy of
lamination pressing temperature curve and prevents resin over-flowing. 4oz
of inner layer copper thickness is guaranteed.
lamination pressing temperature curve and prevents resin over-flowing. 4oz
of inner layer copper thickness is guaranteed.
We have customized plasma desmear machine and
VCP plating line to provide excellent uniformity of via copper plating
VCP plating line to provide excellent uniformity of via copper plating
Advanced Hitachi drilling machine meets your strict via positioning spec of ±0.05mm;
100% electrical resistance test
guarantees excellent stability performance.
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