Technical Parameters
Part Number：S12C04382
Layer count: 12
Board thickness：2.0mm
Dimension：118*57.5mm
Raw material：FR4 TG170 SY
Copper thickness on the board surface：38um
Copper thickness in the hole barrel：20um
Min.line width/space：0.075mm
Minimum hole diameter：0.2mm
Surface finishing：immersion gold≥2u"
Application：DVR for public security surveillance
Technology Feature
Our leading PCB technology capability that meet
strict telecom standards offers an integrated solution from
schematic design and engineering support, to mass production：
Min. via size: 0.2mm,Board thickness: 2.0mm,
Aspect Ratio: 10:1
strict telecom standards offers an integrated solution from
schematic design and engineering support, to mass production：
Min. via size: 0.2mm,Board thickness: 2.0mm,
Aspect Ratio: 10:1
Single ended & differential impedance control ±8%;
Automatic production lines mitigate risk of
manual operation.
manual operation.
IPC standard compliant
strive for 100% FQC pass.
strive for 100% FQC pass.
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