Technical Parameters
Part Number：S12U04997
Layer count: 12
Board thickness：1.6mm
Dimension：111.2*177.6mm
Raw material：FR4 TG170 SY
Copper thickness on the board surface：38um
Copper thickness in the hole barrel：20um
Min.line width/space：0.075mm
Minimum hole diameter：0.2mm
Surface finishing：immersion gold+gold finger
Application：healthcare
Technology Feature
We use selected TG180 material for outstanding quality
consistency and stability performance.
consistency and stability performance.
Our leading PCB technology capability offers an integrated
solution from schematic design and engineering support,
to mass production:
Min. via size: 0.20mm
Min. solder mask dam:0.08mm
solution from schematic design and engineering support,
to mass production:
Min. via size: 0.20mm
Min. solder mask dam:0.08mm
Advanced Tektronix-DSA8200 impedance tester
can meet your strict industry standard: impedance control:±8%
can meet your strict industry standard: impedance control:±8%
IPC class III standard compliant
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