S& L

Engaging in PCB R&D and manufacturing for 18 years Leading the innovation of PCB technology

Technical Parameters

Part Number:S12U04997
Layer count: 12
Board thickness:1.6mm
Raw material:FR4 TG170 SY
Copper thickness on the board surface:38um
Copper thickness in the hole barrel:20um
Min.line width/space:0.075mm
Minimum hole diameter:0.2mm 
Surface finishing:immersion gold+gold finger

Technology Feature

We use selected TG180 material for outstanding quality
consistency and stability performance.














   Our leading PCB technology capability offers an integrated
   solution from schematic design and engineering support,
   to mass production:
   Min. via size: 0.20mm
   Min. solder mask dam:0.08mm








 Advanced Tektronix-DSA8200 impedance tester
can meet your strict industry standard: impedance control:±8%




 IPC class III standard compliant






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