S& L

Engaging in PCB R&D and manufacturing for 18 years Leading the innovation of PCB technology

Technical Parameters

Part Number:M02S12385
Layer count: 2
Board thickness:0.254mm
Raw material:Rogers(R04350B)
Copper thickness on the board surface:≥45um
Copper thickness in the hole barrel:20um
Min.line width/space:0.38mm
Minimum hole diameter:0.4mm 
Surface finishing:immersion silver, 5-12 microinch
Application:telecom amplifier

Technology Feature



High volume production capability - 1 million Sqft.















     We have customized plasma desmear machine and VCP plating line
     to provide excellent uniformity of barrel copper thickness and
     high consistency of impedance value.













   Our tailored solution provides you with the benefits
   of specialized facilities that meet strict telecom
   standards combined with cost efficient manufacturing
   as well as our advantage of strategic partnership
   with world-class advanced micro-wave material.








IPC standard compliant, strive for 100% FQC pass.






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