Technical Parameters
Part Number：M02S12385
Layer count: 2
Board thickness：0.254mm
Dimension：118.8*65.3mm
Raw material：Rogers（R04350B)
Copper thickness on the board surface：≥45um
Copper thickness in the hole barrel：20um
Min.line width/space：0.38mm
Minimum hole diameter：0.4mm
Surface finishing：immersion silver, 5-12 microinch
Application：telecom amplifier
Technology Feature
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High volume production capability - 1 million Sqft.
We have customized plasma desmear machine and VCP plating line
to provide excellent uniformity of barrel copper thickness and
high consistency of impedance value.
to provide excellent uniformity of barrel copper thickness and
high consistency of impedance value.
Our tailored solution provides you with the benefits
of specialized facilities that meet strict telecom
standards combined with cost efficient manufacturing
as well as our advantage of strategic partnership
with world-class advanced micro-wave material.
of specialized facilities that meet strict telecom
standards combined with cost efficient manufacturing
as well as our advantage of strategic partnership
with world-class advanced micro-wave material.
IPC standard compliant, strive for 100% FQC pass.
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