Technical Parameters
Part Number：M02S02629
Layer count: 2
Board thickness：0.68mm
Dimension：249.8*146.3mm
Raw material：Rogers（R04350B)
Copper thickness on the board surface：≥45um
Copper thickness in the hole barrel：25um
Min.line width/space：0.38mm
Minimum hole diameter：0.3mm
Surface finishing：immersion silver, 5-12 microinch
Application：telecom amplifier
Technology Feature
Special double edged milling cutter guarantees slot size tolerance ±0.1mm
and prevents tiny burrs.
and prevents tiny burrs.
We have customized plasma desmear machine and VCP
plating line to provide excellent uniformity of barrel
copper thickness and high consistency of impedance value.
plating line to provide excellent uniformity of barrel
copper thickness and high consistency of impedance value.
Our in-house plating lines (electric silver/immersion
silver/electric tin) eliminate out-sourcing risk
and guarantee better reliability performance.
silver/electric tin) eliminate out-sourcing risk
and guarantee better reliability performance.
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