Technical Parameters
Part Number：M02P00632
Layer count: 2
Board thickness：0.8mm
Dimension：212.2*281.04mm
Raw material：Taconic
Copper thickness on the board surface：≥35um
Copper thickness in the hole barrel：20um
Min.line width/space：0.46mm
Minimum hole diameter：0.9mm
Surface finishing：mmersion tin, >1um
Application：filter
Technology Feature
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High volume production capability - 1 million Sqft.
We have customized plasma desmear machine and VCP plating line
to provide excellent uniformity of barrel copper thickness and
high consistency of impedance value.
to provide excellent uniformity of barrel copper thickness and
high consistency of impedance value.
Our tailored solution provides you with the benefits
of specialized facilities that meet strict telecom
standards combined with cost efficient manufacturing
as well as our advantage of strategic partnership
with world-class advanced micro-wave material.
of specialized facilities that meet strict telecom
standards combined with cost efficient manufacturing
as well as our advantage of strategic partnership
with world-class advanced micro-wave material.
IPC standard compliant, strive for 100% FQC pass.
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