S& L

Engaging in PCB R&D and manufacturing for 18 years Leading the innovation of PCB technology

Technical Parameters

Part Number:M01C02479
Layer count: 1
Board thickness:2.0mm
Raw material:copper base
Copper thickness on the board surface:≥70um
Copper thickness in the hole barrel:25um
Min.line width/space:0.22mm
Minimum hole diameter:0.4mm 
Surface finishing:immersion gold≥1u" 
Application:power supply

Technology Feature


High speed routing + double edged milling cutter for better PCB profiling.













Customized extra thick copper-based material.







Our specialized Burkle pressing machine
provides excellent accuracy of lamination
pressing temperature curve and prevents
resin over-flowing for better high voltage performance.





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