S& L

Engaging in PCB R&D and manufacturing for 18 years Leading the innovation of PCB technology

Technical Parameters

Part Number:M01C13741 
Layer count: 1
Board thickness:1.0mm
Raw material:Aluminium base+FR4, thermal conductivity 2.0w/mk
Copper thickness on the board surface:≥45um
Copper thickness in the hole barrel:20um
Min.line width/space:0.25mm
Minimum hole diameter:0.3mm 
Surface finishing:immersion gold≥1u" 

Technology Feature


High speed routing + double edged milling cutter for better PCB profiling.














Advanced material designed for LED illumination with thermal
  conductivity: 2.0W/m.K and dielectric thickness: 120um.












    Unique SLPS ERP system enables us to monitor
          entire production process in the palm.








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