Technical Parameters
Part Number:M01C13741
Layer count: 1
Board thickness:1.0mm
Dimension:300*300mm
Raw material:Aluminium base+FR4, thermal conductivity 2.0w/mk
Copper thickness on the board surface:≥45um
Copper thickness in the hole barrel:20um
Min.line width/space:0.25mm
Minimum hole diameter:0.3mm
Surface finishing:immersion gold≥1u"
Application:illumination
conductivity: 2.0W/m.K and dielectric thickness: 120um.
Unique SLPS ERP system enables us to monitor
entire production process in the palm.
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