Technical Parameters
Part Number：M02C02679
Layer count: 2
Board thickness：1.0mm
Dimension：235*92mm
Raw material：Aluminium base+FR4, thermal conductivity 2.0w/mk
Copper thickness on the board surface：≥45um
Copper thickness in the hole barrel：25um
Min.line width/space：0.22mm
Minimum hole diameter：0.4mm
Surface finishing：immersion gold≥1u"
Application：automotive LED lighting
Technology Feature
High speed routing + double edged milling cutter for better PCB profiling.
Advanced material designed for LED illumination with thermal
conductivity: 2.0W/m.K and dielectric thickness: 120um.
conductivity: 2.0W/m.K and dielectric thickness: 120um.
Unique SLPS ERP system enables us to monitor
the entire production process in the palm.
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