FPCsupplier understood, the total output value of the global PCB industry reached US$81.741 billion in 2022, a year-on-year increase of 1.0%.With the continuous drive of new technology applications such as AI, 5G network communications, and new energy vehicles, it is estimated that the PCB industry will continue to grow steadily in the next five years.According to Prismark’s prediction, the output value of the global PCB industry will grow at a compound annual growth rate of 3.8% between 2022 and 2027, reaching US$98.388 billion by 2027.

In the next five years, the PCB market is likely to expand from US$81.7 billion in 2022 to US$98.4 billion in 2027, with a compound annual growth rate of 3.8%.

In terms of production area, China will still be the main PCB production base, but it will focus on the development of high-value-added products, and mergers and acquisitions among enterprises are likely to occur. Japan, Taiwan and South Korea will rely more on packaging substrate production. The US and European markets are dominated by military, industrial and medical PCBs. Southeast Asia will accelerate industrial transfer.

High frequency PCB understood，the rapid development of artificial intelligence technology represented by ChatGPT will promote the explosion of AI servers and products in the field of artificial intelligence.In the next five years, 5G, artificial intelligence, the Internet of Things, Industry 4.0, cloud servers, storage devices, automotive electronics, etc. will become new directions driving the growth of PCB demand.At the same time, the global electronic machine and the weak demand in the automotive industry will have a certain impact on the PCB industry.It is predicted that the growth rate of China’s PCB output value will slow down in 2023, reaching 309.663 billion RMB.

Driven by technologies and new applications such as 5G communication, Internet of Things, artificial intelligence, autonomous driving, and intelligent network connection, electronic products will continue to develop in the direction of integration, automation, miniaturization, lightweight, and low energy consumption, thereby promoting PCB continue to develop in the direction of high density, high integration, high speed and high frequency, high heat dissipation, light and thin,and miniaturization.

FPC manufacturer understood，the demand for packaging substrates, high-layer boards, HDI boards, rigid-flex PCB and other products will increase day by day.Among them, packaging substrates benefit from the evolution of packaging technology and the accelerated growth of semiconductor applications.In the medium and long term, their downstream demand will continue to grow at a high speed.