FPC supplier:What Is The Difference Between Flexible PCB Coverlay And Solder Mask Layer
As FPC supplier knows that, the circuitry of the exposed external layers of flexible printed circuits can be encapsulated with either a polyimide coverlay or a flexible solder resist or solder mask. Although both materials perform the same primary function of protecting or insulating the circuitry of the outer layer of a flexible PCB, each material has different features, capabilities, and characteristics that are suitable for certain particular design requirements.
The differences between flexible PCB coverlay and solder mask are:
- A flexible PCB coverlay is a combination of adhesive and Kapton (a polyimide) but a solder mask (solder resist) is liquid-based.
- Coverlay dam sizes should be kept at 10 mils minimum; however, solder mask dam sizes should be kept at 4 mils minimum. The dam stops the flowing of molten, liquefied solder from one pad to another pad nearby
- The trace to mask opening for coverlay can be as close as 3 mils. However, using 3 mils for solder masks could cause undercut or non-recording issues (with respect to the imaging of solder masks). It is advisable you maintain a minimum distance of 4 mils for a solder mask.
- Coverlay is generally used on the flexible sections of flexible printed circuits. A solder mask is made use of on the hard or rigid section of the PCB. However, if you want to make use of coverlay on an entire rigid-flexible PCB, ensure fang opening or window opening is present.
- Unlike a solder mask, coverlay cannot be used on pitch components.
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