Technical Parameters
Part Number：RS02C00270
Layer count: 2
Board thickness：0.2mm
Dimension：78*59.64mm
Raw material：double sided, RD copper without AD
Copper thickness on the board surface：25um
Copper thickness in the hole barrel：12um
Min.line width/space：0.12mm
Minimum hole diameter：0.2mm
Surface finishing：immersion gold≥2u"
Application：healthcare device controller
Technology Feature
Tailored VCP plating line and vacuum etching machine for
specific requirement from medical&healcare market
specific requirement from medical&healcare market
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We have imported LDI machine to meet strict spec of min.line width/space: 0.05/0.05mm
We use selecgted material which is endurable
up to 100,000 times bending.
up to 100,000 times bending.
100% E-testing for outstanding performance of stability
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