S& L

Engaging in PCB R&D and manufacturing for 18 years Leading the innovation of PCB technology

Technical Parameters

Part Number:RM02C00919
Layer count: 2
Board thickness:0.10mm
Raw material:double sided, RD copper without AD
Copper thickness on the board surface:25um
Copper thickness in the hole barrel:12um
Min.line width/space:0.12mm
Minimum hole diameter:0.2mm 
Surface finishing:immersion gold≥1u"

Technology Feature


 We reserves 200,000Sqft capacity in our FPC operation 
for high volume demand from consumer electronics market.









Min.board thickness: 0.1mm.













We understand customer's concern and specially process FPC for great uniformity of solder mask.





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