What are the precautions for creating BOM list in Multi-layer PCB producing service
What are the precautions for creating BOM list in Multi-layer PCB producing service：
1. Detailed and comprehensive
Ideally, the BOM (Bill of Materials) should have comprehensive material information (brand, model, part number, tag number) to help smt chip processing plants create your process control data from scratch. And ensure that suppliers can complete quotation evaluation and delivery estimation in a short time.
2. Mark alternative materials
There may be some critical components that manufacturers are expected to purchase from suppliers who strictly abide by the calibration. At the same time, considering the fluctuation of the component market and the need for cost optimization, alternative models can be selected when necessary.
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3. Functional Assessment
When listing components in the bill of materials, it must be verified according to the engineering design data, and it has been confirmed that it can be produced and used normally. Avoid larger modification costs due to later adjustments.
4. Document Changes
From product design to actual production, changes may occur in the BOM and these changes need to be documented. In order to quickly change the process instructions in the smt patch processing and proofing.
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