Technical Parameters
Part Number：S08C25580
Layer count: 8
Board thickness：1.5mm
Dimension：119*106mm
Raw material：FR4+PI+NFPP
Copper thickness on the board surface：≥35um
Copper thickness in the hole barrel：20um
Min.line width/space：0.075mm
Minimum hole diameter：0.2mm
Surface finishing：immersion gold≥2u"
Application：military UAV
Technology Feature
Customized asymmetric structure.
Specially designed mechanical routing applied for rigid part
to prevent damage to flexible part of board.
to prevent damage to flexible part of board.
Laser profiling applied for flexible part to achieve dimension
tolerance ±0.05mm and reduce the tinny burrs.
tolerance ±0.05mm and reduce the tinny burrs.
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