| Iterm | 2026 | 2027 | 2028 | |
| RPCB | Layers | 48L | 48L | 78L |
| Finish Size | 2000mm×540mm | 2000mm×540mm | 2000mm×540mm | |
Aspect Ratio (PTH) | 12:1 | 12:1 | 12:1 | |
Thickness (power supply industry) | 15 OZ | 15 OZ | 15 OZ | |
| Back drilling (Stub) | +/-0.1mm | +/-0.075mm | +/-0.05mm | |
| HDI | Structure | Any Layer | Any Layer | Any Layer |
| Board thk.(2+8+2) | 0.80mm | 0.6mm | 0.6mm | |
| Line Width/Space | 38um/38um | 38um/38um | 38um/38um | |
| Aspect Ratio(Blind Hole) | 1:1 | 1:1 | 1:1 | |
| FPC | Layers | 8L | 10L | 10L |
| Line Width/Space | 38um/38um | 25um/25um | 25um/25um | |
| Min. hole size | 0.10mm | 0.10mm | 0.10mm | |
Impedance Control | ±7% | ±5% | ±5% | |
| Rigid &Flex | Layers | 10L | 12L | 12L |
| HDI structure | HDI(2+N+2) | HDI(3+N+3) | HDI(3+N+3) | |
MCPCB （IMS-CU/Al/Fe） | Minimum buried copper inlay dimension | 5mm*5mm | 5mm*5mm | 5mm*5mm |
Board thk. | 1.5mm-6.0mm | 1.5mm-6.0mm | 1.5mm-6.0mm | |
| Bendable | yes | yes | yes | |
| Ceramic inlay | yes | yes | yes | |
| Thermoelectric separation | yes | yes | yes | |
| Thermoelectric separation flatness | +/- 0.03mm | +/- 0.03mm | +/- 0.03mm | |
| Surface finish | ENEPIG, HASL, Lead-free HASL, OSP, ENIG, Image, Imm.Sn, Electrolytic Ni/Au, Electrolytic Tin, Electrolytic Silver | |||
