PCB supplier china ：How to prevent Lamination voids
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Popularity：714Dated ：06-21-2022 03:13【big well Small】
As PCB supplier china knows that，the biggest culprit of delamination is when moisture is trapped between layers. It is not an inner layer treatment process issue, but rather is related to the quality of the resin and its potential to absorb moisture. To prevent lamination voids from occurring, inner layer drying is recommended.
Before inner layers are bonded, it is highly recommended that they are oven dried to wick away excess moisture. This helps the prepreg during its curing process.
Lamination voids can also occur when pockets of air get trapped during the lamination process. As the board lamination size increases, the void ratio increases with it. Increasing the resin pressure can help reduce the prevalence of air pockets from forming.
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