Metal core PCB Base Performance
High thermal dissipation and conductivity: Compared to standard FR4 boards, Metal core PCB display better heat dissipation performance. For instance, an FR4 PCB with a thickness of 1.5mm has a heat resistance of 20-22 degrees per watt, while an Aluminum board with a depth of 1.5mm will display a thermal resistance of 1-2 degrees per watt.
There are no major thermal expansion and contraction issues: Every PCB base material has its thermal expansion coefficient. The CTE of Aluminum (22ppm/C) and copper (18ppm/C) are pretty close. Since Aluminum boards have high thermal dissipation properties, they do not experience significant expansion and contraction problems. They function efficiently and are durable and reliable.
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Dimensional stability: Aluminum printed circuit boards display high dimensional stability. For instance, when they are heated from 30-140 degrees, their size changes by 2.5%-3.0%.
Others: You can use Aluminum boards in power device SMT. They are suitable for power devices because of their thermal expansion and circuit design performance. They prolong product shelf life and product power density. Besides, you can use them to reduce the overall product volume.
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