What’s the typical process flow for multi-layer PCB?

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Popularity：655 Dated ：2015-12-15 12:15【big well Small】

Material cutting- Inner dry film- inner etching- Inner AOI- Multi-bond – Layup- Pressing- Drilling- PTH – Panel Plating- Outer Dry Film- Pattern Plating- Outer etching- Outer AOI- Solder Mask- Component Mark – Surface finish- Routing – E/T – Visual Inspection.

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