S& L

Engaging in PCB R&D and manufacturing for 17 years Leading the innovation of PCB technology

Technical Parameters

Layer count: rigid 3 + flex 2
Board thickness: 1.6mm
Min line width/space: 0.13/0.12mm
Base material: FR4+PI+NFPP
Copper thickness: 18um
Surface finish: immersion gold
Technology Feature


         Customized symmetrical structure: 2R+4F+2R                          









Specially designed mechanical routing applied for rigid part to prevent damage to flexible part of board.




 Laser profiling applied for flexible part to achieve
 dimension tolerance ±0.05mm and reduce the tinny burrs
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