S& L

Engaging in PCB R&D and manufacturing for 16 years Leading the innovation of PCB technology

Technical Parameters

Layer count: rigid 3 + flex 2
Board thickness: 1.6mm
Min line width/space: 0.13/0.12mm
Base material: FR4+PI+NFPP
Copper thickness: 18um
Surface finish: immersion gold
Technology Feature

 

         Customized symmetrical structure: 2R+4F+2R                          

 

 


 
 
 
 
 

 

      

 

 

 

Specially designed mechanical routing applied for rigid part to prevent damage to flexible part of board.

 

 

 

 Laser profiling applied for flexible part to achieve
 dimension tolerance ±0.05mm and reduce the tinny burrs
 
 
 
 
 
 
 
 
 
 
 
 
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